Technology drives development toward the next generation of semiconductor and electronics devices. And Celerity’s long history of leading fluid technology delivery expertise – depicted here in a timeline – has helped advance the emergence of tighter geometries and more demanding processes through continuous innovation.
We were the first to introduce flow technology enhancements such as MultiFlo, PTI, and Step. Plus we continue to pioneer significant firsts, as demonstrated by our new ultrasonic sensor, which improves our liquid flow controller’s response time and range for the best possible slurry and wet chemistry control. The sensing technology and control algorithms emerging from our dedicated technology research team in Southern California represent our substantial investment in developing strategies and executing on technology roadmaps with customers. One measure of our success is the number of patents Celerity holds – approximately 150 – as well as dozens of patent pending applications. Even more important is our technology implementation process, which takes our innovations and commercializes them into products that make possible breakthroughs in nanotechnology devices.
2006 August
Dual-Loop Filter
Description: Seamless method for switching multiple filters among global distribution loops.
Benefit or Significance: Supports continuous operation with zero downtime while cleaning any filter without disturbing flows and pressure in any loop.
2006 August
Dual-Loop Switch
Description: Seamless method for switching among two slurry sources and two global distribution loops.
Benefit or Significance: Supports continuous operation with zero downtime while cleaning any source and any loop.
2006 July
Gas Flow Verifier (GFV)
Description: On-tool (in situ) Rate-of-Rise calibrator.
Benefit or Significance: High turn down (1sccm to 3000sccm) in small footprint with <100 torr differential pressure.
2006 June
Ultrasonic Sensor
Description: Unique ultrasonic sensor designed to efficiently transfer energy from the piezo crystals into the fluid.
Benefit or Significance: Improved signal-to-noise ratio for faster response and greater accuracy.
2005 February
Digital Calibration Platform (DCP)
Description: Laboratory Rate-of-Rise flow measurement system.
Benefit or Significance: Preferred MFC metrology-qualification standard for leading dry-etch tool manufacturers.
2004 July
Ultrasonic Liquid Flow Controller
Description: Non-invasive ultrasonic sensing method using advanced frequency domain signal analysis.
Benefit or Significance: Fast response, high accuracy at low flow rates, bubble detection and correction.
2004 February
Surface Mount Gas Stick Heater
Description: Heater designed to place thermal energy directly into the gas flow path.
Benefit or Significance: Eliminates seal retainer. More efficient heating of gas path. Lower cost of ownership. More precise control of the gas temperature.
2003 April
PTI Technology
Description: First industry-accepted Pressure Transient Insensitive MFC. First 300mS response time thermal MFC.
Benefit or Significance: Reduces components on tool, improves tool up time, and lowers cost. Dramatically improves process uniformity and repeatability. Shorter more efficient process cycles.
2003 April
2nd Generation MultiFlo Technology
Description: Sophisticated physics modeling.
Benefit or Significance: Improves accuracy on process gases.
2003 January
Pressure Gauge
Description: Industry's first all-digital pressure gauge.
Benefit or Significance: Advanced zero tracking and diagnostics.
2002 July
MegaShot
Description: Control algorithm for stepped addition of secondary chemistries while monitoring composition in recirculation line.
Benefit or Significance: Minimizes instrumentation costs while achieving accurate blendings.
2002 July
MegaFlex
Description: Regularized, expandable cabinetry and system packaging.
Benefit or Significance: Reduces cost and improves delivery time.
2001 May
Ratio Flow Splitter (RFS)
Description: Module to split process gas from panel into two independent zones on wafer.
Benefit or Significance: Improves wafer uniformity.
2000 August
Whirlpool Reduction Cap
Description: Specially designed drain passageway at bottom of Megaflow day tank.
Benefit or Significance: Promotes homogeneity in mixed colloidal suspensions and provides an order of magnitude (10x) reduction in settled solids and caking on tank walls.
2000 August
SmartBlend
Description: Point-of-use blending for CMP and similar wet chemistries.
Benefit or Significance: Eliminates pot-life issues.
2000 June
MultiFlo Technology
Description: First multi-gas multi-range system available on the market to use a physics-based model to generate process gas pages.
Benefit or Significance: Enables accurate process control and consistent response from N2 characterizations. Reduces field inventory and improves tool up time.
2000 June
K1S
Description: First widely adopted modular gas delivery system.
Benefit or Significance: Substantially reduces gas panel footprint. Still dominates today's architecture for gas panels.
1999 July
IN Series MFC (formerly IntelliFlow)
Description: First all digital MFC.
Benefit or Significance: 1. Eliminates all potentiometers and analog components setting time constants; 2. Includes embedded diagnostics, support for sensor bus networking standards and provides dedicated diagnostics port for e-diagnostics services such as local and remote service sessions transparent to the process control port; 3. Welded straight-through flow path with no seals provides best-in-class dry down.
1998 July
Z-Cube
Description: First interlocking modular block system for gas panels using surface mount components.
Benefit or Significance: Eliminates 30% of the seals and provides low profile. Evolved into K1S.
1998 May
Capacitance Manometer Stress Relief
Description: Reference electrode mechanically isolated from housing.
Benefit or Significance: Improved stability during temperature changes.
1997 September
Integrated Gas System (IGS)
Description: First modular gas delivery system accepted by OEMs in quantity.
Benefit or Significance: Initiates the U.S. transition away from tube-stub welded gas panels.
1997 September
DynaBlend – MegaJet
Description: Nozzles that blend slurry in day tank.
Benefit or Significance: Avoids agglomeration.
1997 July
Versaplane
Description: Mount for modular gas system substrates.
Benefit or Significance: Easy changes in the field.
1996 November
Dual-Shielded Susceptor Thermocouple
Description: Robust assembly providing unique RFI/EMI shielding with rapid temperature response.
Benefit or Significance: Prevents RF interference from semiconductor processing tools. Enables reduction in line width. Extends life of 200 mm tool.
1995 September
Safe Delivery Source (SDS®) Mass Flow Controller
Description: Industry's first low-pressure (10 torr) thermal MFC.
Benefit or Significance: Allows entire contents of SDS implant dopant packaging to be used.
1994 June
1660 Series Mass Flow Controller
Description: First low-cost metal seal MFC.
Benefit or Significance: High purity at an affordable price point.
1994 January
Z-Seal
Description: First low-cost metal seal suited to semiconductor equipment.
Benefit or Significance: Pioneering line of low-cost products for high-purity applications.
1993 June
Throttle Valve
Description: Directly heated disk in addition to heated body.
Benefit or Significance: Eliminates contamination and sticking in CVD exhaust applications.
1992 June
130 Valve
Description: Free floating plunger for electromagnetic valve.
Benefit or Significance: No particle generation, rubbing seals, or flexing diaphragms. Low internal volume.